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翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Thermally conductive pad ： ウィキペディア英語版 Thermally conductive pad In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact;〔(AMD - Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease ) Accessed 23 February 2014〕 they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and well able to fill gaps at higher temperatures.〔 As an alternative to thermal grease (sometimes called thermal transfer material), AMD and Intel have included thermal pads on the bottom of heatsinks shipped with some of their processors, as they are cleaner and generally easier to install. However, thermal pads conduct heat less effectively than a minimal amount of thermal grease.〔 Please note that HWlab's tests were conducted in an unusual scenario: using an overclocked PC with CPU throttling disabled.〕 == References == 〔 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Thermally conductive pad」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.